Invention Grant
- Patent Title: Methods of manufacturing a semiconductor device
- Patent Title (中): 制造半导体器件的方法
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Application No.: US13428900Application Date: 2012-03-23
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Publication No.: US08716093B2Publication Date: 2014-05-06
- Inventor: Jin-Bum Kim , Kwan-Heum Lee , Seung-Hun Lee , Byeong-Chan Lee , Sun-Ghil Lee
- Applicant: Jin-Bum Kim , Kwan-Heum Lee , Seung-Hun Lee , Byeong-Chan Lee , Sun-Ghil Lee
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel Sibley & Sajovec, P.A.
- Priority: KR2008-64069 20080702
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/338 ; H01L21/3205 ; H01L21/4763

Abstract:
A semiconductor device can include a first gate electrode including a gate insulating pattern, a gate conductive pattern and a capping pattern that are sequentially stacked on a semiconductor substrate, and a first spacer of a low dielectric constant disposed on a lower sidewall of the first gate electrode. A second spacer of a high dielectric constant, that is greater than the low dielectric constant, is disposed on an upper sidewall of the first gate electrode above the first spacer.
Public/Granted literature
- US20120184079A1 METHODS OF MANUFACTURING A SEMICONDUCTOR DEVICE Public/Granted day:2012-07-19
Information query
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