Invention Grant
- Patent Title: Integrated circuit packaging system with ultra-thin chip and method of manufacture thereof
- Patent Title (中): 具有超薄芯片的集成电路封装系统及其制造方法
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Application No.: US13426529Application Date: 2012-03-21
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Publication No.: US08716108B2Publication Date: 2014-05-06
- Inventor: Hun Teak Lee , DaeWook Yang , Yeongbeom Ko
- Applicant: Hun Teak Lee , DaeWook Yang , Yeongbeom Ko
- Applicant Address: SG Singapore
- Assignee: Stats Chippac Ltd.
- Current Assignee: Stats Chippac Ltd.
- Current Assignee Address: SG Singapore
- Agency: Ishimaru & Associates LLP
- Main IPC: H01L21/30
- IPC: H01L21/30 ; H01L21/46
Abstract:
A method of manufacture of an integrated circuit packaging system includes: providing a circuit substrate having an active side opposite to an inactive portion; attaching a nonconductive cover to the active side; forming a separation-gap partially cutting into the nonconductive cover and the circuit substrate to a kerf depth; attaching a back-grinding tape to the nonconductive cover; removing a portion of the inactive portion; and exposing the nonconductive cover by removing the back-grinding tape.
Public/Granted literature
- US20130249117A1 INTEGRATED CIRCUIT PACKAGING SYSTEM WITH ULTRA-THIN CHIP AND METHOD OF MANUFACTURE THEREOF Public/Granted day:2013-09-26
Information query
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