Invention Grant
- Patent Title: Structure to reduce electroplated stabilizer content
- Patent Title (中): 结构减少电镀稳定剂含量
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Application No.: US12882654Application Date: 2010-09-15
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Publication No.: US08716188B2Publication Date: 2014-05-06
- Inventor: Yi-Yuan Xie , Kenneth P. Lenseth , Justin Waterman , Venkat Selvamanickam
- Applicant: Yi-Yuan Xie , Kenneth P. Lenseth , Justin Waterman , Venkat Selvamanickam
- Applicant Address: US NY Schenectady
- Assignee: SuperPower, Inc.
- Current Assignee: SuperPower, Inc.
- Current Assignee Address: US NY Schenectady
- Agency: Abel Law Group, LLP
- Agent Thomas P. Weber
- Main IPC: H01L39/24
- IPC: H01L39/24 ; H01B12/02

Abstract:
A superconducting article includes first and second stacked conductor segments. The first stacked conductor segment includes first and second superconductive segments and has a nominal thickness tn1. The second stacked conductor segment includes third and forth superconductive segments and has a nominal thickness tn2. The superconducting article further includes a joint region comprising a first splice connecting the first and third superconductive segments together and a second splice connecting the second and forth superconductive segments together. The first splice is adjacent to and bridged portions of the first and third superconductive segments along at least a portion of the joint region, and the second splice is adjacent to and bridged portions of the second and forth superconductive segments along at least a portion of the joint region. The joint region has a thickness tjr, wherein tjr is not greater than at least one of 1.8tn1 and 1.8tn2.
Public/Granted literature
- US20120065074A1 STRUCTURE TO REDUCE ELECTROPLATED STABILIZER CONTENT Public/Granted day:2012-03-15
Information query
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