Invention Grant
- Patent Title: Resin composition, heat seal film and layered film
- Patent Title (中): 树脂组合物,热封膜和层状膜
-
Application No.: US13700521Application Date: 2011-05-27
-
Publication No.: US08716405B2Publication Date: 2014-05-06
- Inventor: Shigenori Nakano , Kaoru Suzuki
- Applicant: Shigenori Nakano , Kaoru Suzuki
- Applicant Address: JP Tokyo
- Assignee: Du Pont-Mitsui Polychemicals Co. Ltd.
- Current Assignee: Du Pont-Mitsui Polychemicals Co. Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Rankin, Hill & Clark LLP
- Priority: JP2010-127129 20100602
- International Application: PCT/JP2011/062274 WO 20110527
- International Announcement: WO2011/152324 WO 20111208
- Main IPC: C08F8/00
- IPC: C08F8/00 ; C08L33/02 ; C08L23/06 ; C08L23/10

Abstract:
The present invention provides a resin composition including (1) at least one selected from the group consisting of ethylene-α,β-unsaturated carboxylic acid copolymers and ionomers thereof, which have a melt flow rate of from 0.5 g/10 min to 6 g/10 min, (2) at least one selected from the group consisting of ethylene-α,β-unsaturated carboxylic acid copolymers and ionomers thereof, which have a melt flow rate of from 10 g/10 min to 30 g/10 min, and (3) at least one selected from the group consisting of propylene homopolymers and copolymers obtained by copolymerization using propylene and one or more α-olefins excluding propylene, in which a structural unit derived from an α,β-unsaturated carboxylic acid ester is substantially not contained in the total amount of the ethylene-α,β-unsaturated carboxylic acid copolymers and the ionomers thereof.
Public/Granted literature
- US20130079457A1 RESIN COMPOSITION, HEAT SEAL FILM AND LAYERED FILM Public/Granted day:2013-03-28
Information query