Invention Grant
- Patent Title: Silicone resin composition, encapsulating layer, reflector, and optical semiconductor device
- Patent Title (中): 硅树脂组合物，封装层，反射体和光学半导体器件
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Application No.: US13524236Application Date: 2012-06-15
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Publication No.: US08716412B2Publication Date: 2014-05-06
- Inventor: Haruka Fujii , Hiroyuki Katayama
- Applicant: Haruka Fujii , Hiroyuki Katayama
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Sughrue Mion, PLLC
- Priority: JP2011-134575 20110616; JP2011-134576 20110616; JP2011-134577 20110616
- Main IPC: C08L83/04
- IPC: C08L83/04
Abstract:
A silicone resin composition includes a cage octasilsesquioxane; a polysiloxane containing alkenyl groups at both ends containing an alkenyl group having the number of moles smaller than the number of moles of the hydrosilyl group of the cage octasilsesquioxane; a hydrosilylation catalyst; a hydroxyl group-containing polysiloxane, organohydrogenpolysiloxane, or a polysiloxane containing alkenyl groups at side chain.
Public/Granted literature
- US20120319154A1 SILICONE RESIN COMPOSITION, ENCAPSULATING LAYER, REFLECTOR, AND OPTICAL SEMICONDUCTOR DEVICE Public/Granted day:2012-12-20
Information query
