Invention Grant
- Patent Title: Aramid copolymer
- Patent Title (中): 芳族聚酰胺共聚物
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Application No.: US13559669Application Date: 2012-07-27
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Publication No.: US08716433B2Publication Date: 2014-05-06
- Inventor: Kiu-Seung Lee
- Applicant: Kiu-Seung Lee
- Applicant Address: US DE Wilmington
- Assignee: E I du Pont de Nemours and Company
- Current Assignee: E I du Pont de Nemours and Company
- Current Assignee Address: US DE Wilmington
- Main IPC: C08G64/00
- IPC: C08G64/00 ; C08G75/00
Abstract:
The invention concerns polymer comprising residues of 2-(4-amino phenyl)-5 (6) amino benzimidazole (DAPBI), paraphenylene diamine, and terephthaloyl dichloride, the polymer having a IPC peak block ratio of 1.45 to 1.47 and an inherent viscosity of greater than 2 dl/g.
Public/Granted literature
- US20130203956A1 ARAMID COPOLYMER Public/Granted day:2013-08-08
Information query
