Embodiments of the invention provide a substrate and a method for constructing a substrate with electrostatic discharge protection. The substrate includes an edge surface with at least one plated castellation capable of conducting electrostatic discharge. The at least one plated castellation is connected to a circuit trace on at least one of the bottom surface and the top surface of the substrate. The method includes punching holes along at least a portion of a perimeter of each of a plurality of substrates in a substrate array, plating the holes with a conductive material, and cutting each of the plurality of substrates along cut lines that bisect at least some of the holes.