Invention Grant
- Patent Title: Light emitting device and light emitting device package for improving a light emission efficiency
- Patent Title (中): 发光器件和用于提高发光效率的发光器件封装
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Application No.: US13679724Application Date: 2012-11-16
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Publication No.: US08716693B2Publication Date: 2014-05-06
- Inventor: Hyo Kun Son
- Applicant: LG Innotek Co., Ltd
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: McKenna Long & Aldridge LLP
- Priority: KR10-2009-0101959 20091026
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L31/00

Abstract:
A light emitting device, a method of manufacturing the same, a light emitting device package, and a lighting system are disclosed. The light emitting device may include a first conductive semiconductor layer, a second conductive semiconductor layer, and an active layer interposed between the first and second conductive semiconductor layers. The first conductive semiconductor layer, the active layer, and the second conductive semiconductor layer may include Al. The second conductive semiconductor layer may have Al content higher than Al content of the first conductive semiconductor layer. The first conductive semiconductor layer may have Al content higher than Al content of the active layer.
Public/Granted literature
- US20130075695A1 LIGHT EMITTING DEVICE AND LIGHT EMITTING DEVICE PACKAGE Public/Granted day:2013-03-28
Information query
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