Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US13816511Application Date: 2011-04-15
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Publication No.: US08716717B2Publication Date: 2014-05-06
- Inventor: Tsuyoshi Kawakami , Akihiko Furukawa , Naruhisa Miura , Yasuhiro Kagawa , Kenji Hamada , Yoshiyuki Nakaki
- Applicant: Tsuyoshi Kawakami , Akihiko Furukawa , Naruhisa Miura , Yasuhiro Kagawa , Kenji Hamada , Yoshiyuki Nakaki
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Oblon, Spivak, McClelland, Maier & Neustadt, L.L.P.
- Priority: JP2010-232174 20101015
- International Application: PCT/JP2011/059397 WO 20110415
- International Announcement: WO2012/049872 WO 20120419
- Main IPC: H01L29/12
- IPC: H01L29/12

Abstract:
A RESURF layer including a plurality of P-type implantation layers having a low concentration of P-type impurity is formed adjacent to an active region. The RESURF layer includes a first RESURF layer, a second RESURF layer, a third RESURF layer, a fourth RESURF layer, and a fifth RESURF layer that are arranged sequentially from the P-type base side so as to surround the P-type base. The second RESURF layer is configured with small regions having an implantation amount equal to that of the first RESURF layer and small regions having an implantation amount equal to that of the third RESURF layer being alternately arranged in multiple. The fourth RESURF layer is configured with small regions having an implantation amount equal to that of the third RESURF layer and small regions having an implantation amount equal to that of the fifth RESURF layer being alternately arranged in multiple.
Public/Granted literature
- US20130140582A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME Public/Granted day:2013-06-06
Information query
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