An LED module comprises a platform having a recession, wherein the recession presents a center section with a bottom and an enlarged section surrounding the center portion. An LED chip is arranged on the bottom of the center section. A bond wire leads from the LED chip to the bottom of the enlarged section in order to contact a first electrode of the LED chip. In one embodiment the bond wire is electrically connected to the back side of the platform by means of a through contact leading from the bottom of the enlarged section through the platform to the backside of the platform. In another embodiment a first conducting path leads from a first electrode of the LED chip across the side wall of the recession to the surface of the platform and from there across a lateral wall of the platform to the back side of the platform. A second conducting path, electrically isolated from the first conducting path, leads from a second electrode of the LED chip across the side wall of the recession to the to surface of the platform and from there across a lateral wall of the platform to the back side of the platform.