A highly reliable LED package mounting structure which can realize improvement in solder fatigue life at low costs is provided. An LED package has a light-emitting surface which is perpendicular to a mounting surface of a circuit board, comprises connection terminal portions on the side face or on the side face and the bottom face of the package, and is joined with the circuit board by soldering via the connection terminal portion. Furthermore, the shape of the solder is optimized by defining the relative position relation between the end of an electrode on the central side of the LED package on the bottom face of an LED package body and the end of a component mounting pad on the circuit board.