Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13205845Application Date: 2011-08-09
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Publication No.: US08716746B2Publication Date: 2014-05-06
- Inventor: Masaki Koyama , Yasushi Ookura , Akitaka Soeno , Tatsuji Nagaoka , Takahide Sugiyama , Sachiko Aoi , Hiroko Iguchi
- Applicant: Masaki Koyama , Yasushi Ookura , Akitaka Soeno , Tatsuji Nagaoka , Takahide Sugiyama , Sachiko Aoi , Hiroko Iguchi
- Applicant Address: JP Kariya JP Toyota
- Assignee: DENSO CORPORATION,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: DENSO CORPORATION,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Kariya JP Toyota
- Agency: Posz Law Group, PLC
- Priority: JP2010-182356 20100817; JP2010-195837 20100901
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
In a semiconductor device, an IGBT cell includes a trench passing through a base layer of a semiconductor substrate to a drift layer of the semiconductor substrate, a gate insulating film on an inner surface of the trench, a gate electrode on the gate insulating film, a first conductivity-type emitter region in a surface portion of the base layer, and a second conductivity-type first contact region in the surface portion of the base layer. The IGBT cell further includes a first conductivity-type floating layer disposed within the base layer to separate the base layer into a first portion including the emitter region and the first contact region and a second portion adjacent to the drift layer, and an interlayer insulating film disposed to cover an end of the gate electrode. A diode cell includes a second conductivity-type second contact region in the surface portion of the base layer.
Public/Granted literature
- US20120043581A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-02-23
Information query
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