Invention Grant
- Patent Title: Semiconductor device and associated fabrication method
- Patent Title (中): 半导体器件及相关制造方法
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Application No.: US13278463Application Date: 2011-10-21
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Publication No.: US08716784B2Publication Date: 2014-05-06
- Inventor: Lei Zhang , Tiesheng Li
- Applicant: Lei Zhang , Tiesheng Li
- Applicant Address: CN Chengdu
- Assignee: Chengdu Monolithic Power Systems Co., Ltd.
- Current Assignee: Chengdu Monolithic Power Systems Co., Ltd.
- Current Assignee Address: CN Chengdu
- Agency: Perkins Coie LLP
- Priority: CN201010526997 20101022
- Main IPC: H01L29/76
- IPC: H01L29/76 ; H01L29/94 ; H01L29/80 ; H01L31/062 ; H01L31/113

Abstract:
A semiconductor device and a method for forming the semiconductor device wherein the semiconductor comprises: a trench MOSFET, formed on a semiconductor initial layer, comprising a well region, wherein the semiconductor initial layer has a first conductivity type and wherein the well region has a second conductivity type; an integrated Schottky diode next to the trench MOSFET, comprising a anode metal layer contacted to the semiconductor initial layer; a trench isolation structure, coupled between the trench MOSFET and integrated Schottky diode, configured to resist part of lateral diffusion from the well region; wherein the well region comprises an overgrowth part which laterally diffuses under the trench isolation structure and extends out of it.
Public/Granted literature
- US20120098058A1 Semiconductor Device and Associated Fabrication Method Public/Granted day:2012-04-26
Information query
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