Invention Grant
- Patent Title: Semiconductor device
- Patent Title (中): 半导体器件
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Application No.: US13410422Application Date: 2012-03-02
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Publication No.: US08716811B2Publication Date: 2014-05-06
- Inventor: Hideki Mori , Chihiro Arai
- Applicant: Hideki Mori , Chihiro Arai
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Dentons US LLP
- Priority: JP2011-071044 20110328
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor device includes a first conduction-type semiconductor substrate, a first semiconductor region of a first conduction-type formed on the semiconductor substrate, a second semiconductor region of a second conduction-type formed on a surface of the first semiconductor region, a third semiconductor region of the second conduction-type formed to be separated from the second semiconductor region on the surface of the first semiconductor region, a fourth semiconductor region of the second conduction-type formed to be separated from the second semiconductor region and the third semiconductor region on the surface of the first semiconductor region, and a first electrode connected to the second semiconductor region and the third semiconductor region.
Public/Granted literature
- US20120248541A1 SEMICONDUCTOR DEVICE Public/Granted day:2012-10-04
Information query
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