Invention Grant
- Patent Title: Semiconductor structure and manufacturing method for the same
- Patent Title (中): 半导体结构及制造方法相同
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Application No.: US13166091Application Date: 2011-06-22
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Publication No.: US08716825B2Publication Date: 2014-05-06
- Inventor: Wing-Chor Chan , Chung-Yu Hung , Chien-Wen Chu
- Applicant: Wing-Chor Chan , Chung-Yu Hung , Chien-Wen Chu
- Applicant Address: TW Hsinchu
- Assignee: Macronix International Co., Ltd.
- Current Assignee: Macronix International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66

Abstract:
A semiconductor structure and a manufacturing method for the same are provided. The semiconductor structure includes a well region, a dielectric structure, a first doped layer, a second doped layer and a first doped region. The dielectric structure is on the well region. The dielectric structure has a first dielectric sidewall and a second dielectric sidewall opposite to each other. The dielectric structure includes a first dielectric portion and a second dielectric portion, between the first dielectric sidewall and the second dielectric sidewall. The first doped layer is on the well region between the first dielectric portion and the second dielectric portion. The second doped layer is on the first doped layer. The first doped region is in the well region on the first dielectric sidewall.
Public/Granted literature
- US20120326261A1 SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD FOR THE SAME Public/Granted day:2012-12-27
Information query
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