Invention Grant
- Patent Title: Semiconductor structure including guard ring
- Patent Title (中): 半导体结构包括保护环
-
Application No.: US13245891Application Date: 2011-09-27
-
Publication No.: US08716832B2Publication Date: 2014-05-06
- Inventor: Martin Kerber
- Applicant: Martin Kerber
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Infineon Technologies AG
- Agent Philip H. Schlazer
- Main IPC: H01L27/08
- IPC: H01L27/08
Abstract:
One or more embodiments related to a semiconductor structure, comprising: a conductive feature; an outer guard ring; and an inner guard ring between the outer guard ring and the conductive feature, the inner guard ring being electrically coupled to the conductive feature.
Public/Granted literature
- US20130075859A1 Semiconductor structure including guard ring Public/Granted day:2013-03-28
Information query
IPC分类:
