Invention Grant
- Patent Title: Semiconductor device including antenna
- Patent Title (中): 半导体器件包括天线
-
Application No.: US11792372Application Date: 2005-12-21
-
Publication No.: US08716834B2Publication Date: 2014-05-06
- Inventor: Kiyoshi Kato , Yoshitaka Moriya
- Applicant: Kiyoshi Kato , Yoshitaka Moriya
- Applicant Address: JP Atsugi-shi, Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Atsugi-shi, Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office, P.C.
- Agent Eric J. Robinson
- Priority: JP2004-374913 20041224
- International Application: PCT/JP2005/023994 WO 20051221
- International Announcement: WO2006/068286 WO 20060629
- Main IPC: H01L21/02
- IPC: H01L21/02

Abstract:
A semiconductor device that can prevent reduction in the amplitude of electromagnetic waves transmitted from a reader/writer, and can prevent heating of an element forming layer due to a change in a magnetic field. The semiconductor device of the invention has an element forming layer formed over a substrate, and an antenna connected to the element forming layer. The element forming layer has at least wires such as a power supply wire and a ground wire that are arranged in a non-circular shape. The element forming layer and the antenna may be provided so as to overlap each other at least partially. The antenna may be provided above or below the element forming layer.
Public/Granted literature
- US20080087990A1 Semiconductor Device Public/Granted day:2008-04-17
Information query
IPC分类: