Invention Grant
- Patent Title: Lead frame strip for reduced mold sticking during degating
- Patent Title (中): 引线框架条,用于减少脱模期间的模具粘贴
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Application No.: US13087475Application Date: 2011-04-15
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Publication No.: US08716845B2Publication Date: 2014-05-06
- Inventor: Norbert Joson Santos , Edgar Dorotayo Balidoy , Anthony Steven Dominisac Panagan , Jerry Gomez Cayabyab , Ferdinand S. Signey
- Applicant: Norbert Joson Santos , Edgar Dorotayo Balidoy , Anthony Steven Dominisac Panagan , Jerry Gomez Cayabyab , Ferdinand S. Signey
- Applicant Address: US TX Dallas
- Assignee: Texas Instruments Incorporated
- Current Assignee: Texas Instruments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Steven A. Shaw; Wade James Brady, III; Frederick J. Telecky, Jr.
- Main IPC: H01L23/495
- IPC: H01L23/495

Abstract:
A lead frame strip includes an array of sites arranged in at least one row connected to two exterior side rails which traverse the lead frame strip on two opposite sides. Each of the sites is further connected to the two exterior side rails by subrails which extend between the two exterior side rails. Interior side rails extend between the subrails having a length dimension oriented along a first direction. The interior side rails include at least one punch degating aperture having an aperture length oriented along the first direction, wherein a total of the aperture length along the interior side rails is greater than or equal to the die pad length.
Public/Granted literature
- US20120261806A1 LEAD FRAME STRIP FOR REDUCED MOLD STICKING DURING DEGATING Public/Granted day:2012-10-18
Information query
IPC分类: