Invention Grant
- Patent Title: Tin-based solder ball and semiconductor package including the same
- Patent Title (中): 锡基焊球和包括其的半导体封装
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Application No.: US13714200Application Date: 2012-12-13
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Publication No.: US08716860B2Publication Date: 2014-05-06
- Inventor: Young Woo Lee , Im Bok Lee , Sung Jae Hong , Jeong Tak Moon
- Applicant: MK Electron Co., Ltd.
- Applicant Address: KR
- Assignee: MK Electron Co., Ltd.
- Current Assignee: MK Electron Co., Ltd.
- Current Assignee Address: KR
- Agency: Volpe and Koenig, P.C.
- Priority: KR2011-0134466 20111214
- Main IPC: H01L23/48
- IPC: H01L23/48 ; H01L23/52 ; H01L29/40
Abstract:
A tin (Sn)-based solder ball and a semiconductor package including the same are provided. The tin-based solder ball includes about 0.2 to 4 wt. % silver (Ag), about 0.1 to 1 wt. % copper (Cu), about 0.001 to 0.3 wt. % aluminum (Al), about 0.001% to 0.1 wt. % germanium (Ge), and balance of tin and unavoidable impurities. The tin-based solder ball has a high oxidation resistance.
Public/Granted literature
- US20130175688A1 TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME Public/Granted day:2013-07-11
Information query
IPC分类:
