Invention Grant
- Patent Title: Solderless die attach to a direct bonded aluminum substrate
- Patent Title (中): 无焊模贴附于直接键合的铝基板上
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Application No.: US13490459Application Date: 2012-06-07
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Publication No.: US08716864B2Publication Date: 2014-05-06
- Inventor: Nathan Zommer
- Applicant: Nathan Zommer
- Applicant Address: US CA Milpitas
- Assignee: IXYS Corporation
- Current Assignee: IXYS Corporation
- Current Assignee Address: US CA Milpitas
- Agency: Imperium Patent Works
- Agent T. Lester Wallace; Darien K. Wallace
- Main IPC: H01L29/72
- IPC: H01L29/72
Abstract:
A DBA-based power device includes a DBA (Direct Bonded Aluminum) substrate. An amount of silver nanoparticle paste of a desired shape and size is deposited (for example by micro-jet deposition) onto a metal plate of the DBA. The paste is then sintered, thereby forming a sintered silver feature that is in electrical contact with an aluminum plate of the DBA. The DBA is bonded (for example, is ultrasonically welded) to a lead of a leadframe. Silver is deposited onto the wafer back side and the wafer is singulated into dice. In a solderless silver-to-silver die attach process, the silvered back side of a die is pressed down onto the sintered silver feature on the top side of the DBA. At an appropriate temperature and pressure, the silver of the die fuses to the sintered silver of the DBA. After wirebonding, encapsulation and lead trimming, the DBA-based power device is completed.
Public/Granted literature
- US20130328204A1 Solderless Die Attach to a Direct Bonded Aluminum Substrate Public/Granted day:2013-12-12
Information query
IPC分类:
