Invention Grant
- Patent Title: Semiconductor device including light emitting element
- Patent Title (中): 包括发光元件的半导体器件
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Application No.: US13683593Application Date: 2012-11-21
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Publication No.: US08716933B2Publication Date: 2014-05-06
- Inventor: Shunpei Yamazaki , Takeshi Fukunaga
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP
- Agency: Husch Blackwell LLP
- Priority: JP11-356736 19991215
- Main IPC: H05B33/04
- IPC: H05B33/04 ; H01L51/52

Abstract:
A light-emitting device having the quality of an image high in homogeneity is provided. A printed wiring board (second substrate) (107) is provided facing a substrate (first substrate) (101) that has a luminous element (102) formed thereon. A PWB side wiring (second group of wirings) (110) on the printed wiring board (107) is electrically connected to element side wirings (first group of wirings) (103, 104) by anisotropic conductive films (105a, 105b). At this point, because a low resistant copper foil is used to form the PWB side wiring (110), a voltage-drop of the element side wirings (103, 104) and a delay of a signal can be reduced. Accordingly, the homogeneity of the quality of an image is improved, and the operating speed of a driver circuit portion is enhanced.
Public/Granted literature
- US20130092911A1 Light-Emitting Device Public/Granted day:2013-04-18
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