Invention Grant
- Patent Title: Testing fuse configurations in semiconductor devices
- Patent Title (中): 测试半导体器件中的保险丝配置
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Application No.: US13206434Application Date: 2011-08-09
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Publication No.: US08717052B2Publication Date: 2014-05-06
- Inventor: Adrian E. Ong , Paul Fuller , Nick van Heel , Mark Thomann
- Applicant: Adrian E. Ong , Paul Fuller , Nick van Heel , Mark Thomann
- Applicant Address: US CA Sunnyvale
- Assignee: Rambus Inc.
- Current Assignee: Rambus Inc.
- Current Assignee Address: US CA Sunnyvale
- Agency: Lowenstein Sandler LLP
- Main IPC: G01R31/3187
- IPC: G01R31/3187

Abstract:
Methods, systems, and apparatus for testing semiconductor devices. A semiconductor device includes one or more external terminals configured to receive fuse configuration data from an external source. The semiconductor device also includes a soft-blow circuit to generate a soft-blow signal based on the fuse configuration data, and a fuse circuit that includes a fuse and has first and second operational states corresponding to the fuse being intact and blown, respectively. The fuse circuit is configured to receive the soft-blow signal and to select its operational state to be the first or second operational state based on the received soft-blow signal.
Public/Granted literature
- US20110291693A1 TESTING FUSE CONFIGURATIONS IN SEMICONDUCTOR DEVICES Public/Granted day:2011-12-01
Information query
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