Invention Grant
- Patent Title: Resonator device
- Patent Title (中): 谐振器装置
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Application No.: US13085448Application Date: 2011-04-12
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Publication No.: US08717108B2Publication Date: 2014-05-06
- Inventor: Paul G. Rosadiuk , Walid M. Al-Bondak , Bruce A. Igawa , Bryce Smith
- Applicant: Paul G. Rosadiuk , Walid M. Al-Bondak , Bruce A. Igawa , Bryce Smith
- Applicant Address: US IL Chicago
- Assignee: The Boeing Company
- Current Assignee: The Boeing Company
- Current Assignee Address: US IL Chicago
- Agency: Toler Law Group, PC
- Main IPC: H03B1/00
- IPC: H03B1/00 ; H03B5/18 ; H01P3/06

Abstract:
A coaxial resonator device includes a substrate including a chip-and-wire circuit. A resonator is coupled to the substrate using a conductive epoxy. A system includes a resonator device. The resonator device includes a housing having one or more connectors, a resonator coupled to the housing a conductive epoxy, and a chip-and-wire circuit connecting the resonator to the one or more connectors.
Public/Granted literature
- US20120262253A1 RESONATOR DEVICE Public/Granted day:2012-10-18
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