Invention Grant
- Patent Title: Bulk acoustic wave resonator
- Patent Title (中): 体声波谐振器
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Application No.: US13900705Application Date: 2013-05-23
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Publication No.: US08717121B2Publication Date: 2014-05-06
- Inventor: Hiroshi Kawai , Koichi Yoshida , Naoto Yatani , Makoto Inai
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyota
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyota
- Agency: Keating & Bennett, LLP
- Priority: JP2010-266105 20101130
- Main IPC: H03H9/00
- IPC: H03H9/00 ; H03H9/15

Abstract:
A bulk acoustic wave resonator includes a substrate, a resonator section in which a piezoelectric film is sandwiched between a pair of electrodes, and a vibration region where the electrodes overlap when viewed in a film thickness direction is defined, an elastically deformable support section that connects the substrate and the resonator section, a membrane arranged between the resonator section and the substrate to face the vibration region of the resonator section and be fixed on the substrate with a space in between, and driver sections that are defined in the resonator section and the substrate adjacent to the vibration region and the membrane, and that move the resonator section toward and away from the substrate. The vibration region of the resonator section contacts the membrane when the driver sections move the resonator section close to the substrate.
Public/Granted literature
- US20130249649A1 BULK ACOUSTIC WAVE RESONATOR Public/Granted day:2013-09-26
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