Invention Grant
- Patent Title: Electronic component and method of manufacturing the same
- Patent Title (中): 电子部件及其制造方法
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Application No.: US13566836Application Date: 2012-08-03
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Publication No.: US08717135B2Publication Date: 2014-05-06
- Inventor: Koichiro Wada , Masashi Kuwahara , Yoshinari Nakada , Yuichi Kasuya , Masanori Takahashi , Tetsuo Kumahora
- Applicant: Koichiro Wada , Masashi Kuwahara , Yoshinari Nakada , Yuichi Kasuya , Masanori Takahashi , Tetsuo Kumahora
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Law Office of Katsuhiro Arai
- Priority: JP2011-183443 20110825
- Main IPC: H01F27/02
- IPC: H01F27/02 ; H01F27/24

Abstract:
An electronic component has a drum-shaped core member constituted by an assembly of soft magnetic alloy grains containing iron (Fe), silicate (Si) and chromium (Cr), a coil conductive wire wound around the core member, a pair of terminal electrodes connected to ends of the coil conductive wire, and an outer sheath resin part covering the wound coil conductive wire and constituted by a magnetic powder-containing resin; wherein there is an area where only the resin material in the magnetic powder-containing resin is permeated from the surface of the core member to a specified depth.
Public/Granted literature
- US20130200972A1 ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2013-08-08
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