Invention Grant
- Patent Title: Thermally responsive switch
- Patent Title (中): 热响应开关
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Application No.: US12866500Application Date: 2008-02-08
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Publication No.: US08717140B2Publication Date: 2014-05-06
- Inventor: Tomohiro Hori , Atsushi Chiba
- Applicant: Tomohiro Hori , Atsushi Chiba
- Applicant Address: JP Nagoya-Shi, Aichi
- Assignee: Ubukata Industries Co., Ltd.
- Current Assignee: Ubukata Industries Co., Ltd.
- Current Assignee Address: JP Nagoya-Shi, Aichi
- Agency: Thomas & Karceski, PC
- International Application: PCT/JP2008/000191 WO 20080208
- International Announcement: WO2009/098735 WO 20090813
- Main IPC: H01H37/64
- IPC: H01H37/64 ; H01H37/68 ; H01H37/54 ; H01H1/0237 ; H01H50/02

Abstract:
A thermally responsive switch includes an airtight container including a metal housing and a header plate, conductive terminal pins airtightly fixed to the header plate, a fixed contact fixed to the conductive terminal pin, a thermally responsive plate one end of which is conductively connected to and fixed to the inner surface of the airtight container and the bending direction of which is reversed at a predetermined temperature, and a movable contact fixed to the other end of the thermally responsive plate. In the thermally responsive switch, the movable contact and the fixed contact are composed of a silver tin oxide based contact and gas containing 50% or more and 95% or less of helium is encapsulated in the airtight container in such a manner that gas pressure is equal to or more than 0.35 and equal to or less than 0.7 at ordinary temperature.
Public/Granted literature
- US20100315193A1 THERMALLY RESPONSIVE SWITCH Public/Granted day:2010-12-16
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