Invention Grant
- Patent Title: Electrofluidic device and operation method thereof
- Patent Title (中): 电流装置及其操作方法
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Application No.: US13072779Application Date: 2011-03-28
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Publication No.: US08717281B2Publication Date: 2014-05-06
- Inventor: Yun-Sheng Ku , Wei-Yuan Cheng , Pei-Ju Su , Shu-Wei Kuo
- Applicant: Yun-Sheng Ku , Wei-Yuan Cheng , Pei-Ju Su , Shu-Wei Kuo
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW99143520A 20101213
- Main IPC: G09G3/34
- IPC: G09G3/34

Abstract:
An electrofluidic device includes first structural layer and second structural layer. First structural layer includes first substrate; and first electrode and second electrode on the first substrate. The second electrode has an indent region surrounding and without contacting first electrode. First hydrophobic layer is at least over the second electrode. Second structural layer at one side of the first structural layer with a gap includes second substrate and groove structure layer. The groove structure layer includes an indent groove, corresponding to the indent region of the second electrode. Second hydrophobic layer is over the groove structure layer. Polar fluid is disposed in the indent groove and remains in contact with the first electrode. Non-polar fluid is disposed in the gap between the first and second structural layers.
Public/Granted literature
- US20120146984A1 ELECTROFLUIDIC DEVICE AND OPERATION METHOD THEREOF Public/Granted day:2012-06-14
Information query
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