Invention Grant
- Patent Title: Cooling system for electronic device and electronic device having same
- Patent Title (中): 电子设备冷却系统及其电子设备
-
Application No.: US13439865Application Date: 2012-04-05
-
Publication No.: US08717763B2Publication Date: 2014-05-06
- Inventor: Tai-Wei Lin , Chin-Hui Chen
- Applicant: Tai-Wei Lin , Chin-Hui Chen
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F24F7/06

Abstract:
A cooling system includes a first group of fans, a second group of fans, and an air conducting cover. The air conducting cover includes a first partition, a second partition, a third partition. The first partition is connected between the second partition and the third partition to define a first space, a second space and a third space. Wherein the first group of fans directs air flow to enter the first space and the second space, the second group of fans directs air flow to enter the third space.
Public/Granted literature
- US20130155614A1 COOLING SYSTEM FOR ELECTRONIC DEVICE AND ELECTRONIC DEVICE HAVING SAME Public/Granted day:2013-06-20
Information query