Invention Grant
- Patent Title: Integrated-inverter electric compressor and inverter unit thereof
- Patent Title (中): 集成逆变电动压缩机及其逆变器单元
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Application No.: US13000775Application Date: 2009-11-26
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Publication No.: US08717765B2Publication Date: 2014-05-06
- Inventor: Makoto Hattori , Kazuki Niwa , Takashi Nakagami , Koji Nakano , Shunsuke Yakushiji
- Applicant: Makoto Hattori , Kazuki Niwa , Takashi Nakagami , Koji Nakano , Shunsuke Yakushiji
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee: Mitsubishi Heavy Industries, Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Westerman, Hattori, Daniels & Adrian, LLP
- Priority: JP2008-311305 20081205
- International Application: PCT/JP2009/069918 WO 20091126
- International Announcement: WO2010/064565 WO 20100610
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H05K5/02 ; H01L25/00

Abstract:
An integrated-inverter electric compressor and an inverter unit thereof are provided, with which sufficient anti-vibration properties can be ensured and weight reduction can be achieved. In an integrated-inverter electric compressor, an inverter unit includes an inverter module in which a power-system metallic board having mounted thereon semiconductor switching elements and so forth is integrated with a plastic case, and a CPU board having mounted thereon a control and communication circuit that operates at a low voltage, such as a CPU, is provided on a top face of the inverter module, and inside the plastic case, a thermosetting resin layer for insulation and anti-humidity purposes is provided so as to cover a top face of the power-system metallic board, and a vibration-absorbing elastomeric adhesive layer that maintains a rubber state in an operating temperature range of the integrated-inverter electric compressor is provided between a bottom face of the CPU board and the thermosetting resin layer.
Public/Granted literature
- US20110095659A1 INTEGRATED-INVERTER ELECTRIC COMPRESSOR AND INVERTER UNIT THEREOF Public/Granted day:2011-04-28
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