Invention Grant
- Patent Title: Multi-plate board embedded capacitor and methods for fabricating the same
- Patent Title (中): 多板电路板嵌入式电容器及其制造方法
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Application No.: US13040841Application Date: 2011-03-04
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Publication No.: US08717773B2Publication Date: 2014-05-06
- Inventor: Daniel Z. Abawi
- Applicant: Daniel Z. Abawi
- Applicant Address: US NY Schenectady
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Schenectady
- Agency: Fletcher Yoder P.C.
- Main IPC: H05K1/18
- IPC: H05K1/18 ; H05K1/14

Abstract:
A printed wiring board (PWB) including one or more embedded capacitors. The PWB defines a planar area and includes a plurality of first conductive plates that are substantially parallel to the planar area and extend from a first normal axis towards a second normal axis. The first normal axis and the second normal axis extend substantially perpendicularly through the planar area. The PWB also includes one or more second conductive plates that are substantially parallel to the planar area and extend from the second normal axis towards the first normal axis. The second conductive plates are positioned between the first conductive plates. A non-conductive material is positioned between the first and second conductive plates. At least one first conductive via extends substantially collinear with the first normal axis in contact with the first conductive plates. A plurality of second conductive vias extends substantially collinear with the second normal axis in contact with the second conductive plate.
Public/Granted literature
- US20120224333A1 MULTI-PLATE BOARD EMBEDDED CAPACITOR AND METHODS FOR FABRICATING THE SAME Public/Granted day:2012-09-06
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