Invention Grant
- Patent Title: Fingerprint sensor package and method
- Patent Title (中): 指纹传感器封装及方法
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Application No.: US12848833Application Date: 2010-08-02
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Publication No.: US08717775B1Publication Date: 2014-05-06
- Inventor: David Bolognia , Ted Adlam , Mike Kelly
- Applicant: David Bolognia , Ted Adlam , Mike Kelly
- Applicant Address: US AZ Chandler
- Assignee: Amkor Technology, Inc.
- Current Assignee: Amkor Technology, Inc.
- Current Assignee Address: US AZ Chandler
- Agency: McAndrews, Held & Malloy
- Main IPC: H05K1/11
- IPC: H05K1/11

Abstract:
A fingerprint sensor package includes a flat surface having a dielectric protective coating protecting a sensing element of a fingerprint sensor and an electrically conductive bezel that discharges electrostatic discharge (ESD). Both the protective coating and the bezel can be colored to have desired colors. Accordingly, the flat surface can be colored as desired enhancing the attractiveness for consumer applications. Further, light emitting diodes are integrated into the fingerprint sensor package providing a visual feedback to the user that the user's fingerprint has been successfully sensed. Further, the fingerprint sensor package is formed using a high volume low cost assembly technique.
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