Invention Grant
- Patent Title: Electronic device and ground connection structure
- Patent Title (中): 电子设备和接地连接结构
-
Application No.: US13461430Application Date: 2012-05-01
-
Publication No.: US08717778B2Publication Date: 2014-05-06
- Inventor: Tadanori Tachikawa , Masuo Ohnishi
- Applicant: Tadanori Tachikawa , Masuo Ohnishi
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2008-143311 20080530
- Main IPC: H05K9/00
- IPC: H05K9/00

Abstract:
An electronic device including: a circuit board on which an electronic component is mounted; a plate material which is used as a ground, the plate material being extended in parallel with the circuit board; and a ground connection member which includes a fixed section and multiple elastic leg sections, the fixed section being tightened to the circuit board and connected to a ground on the circuit board, the elastic leg sections being extended from the fixed section toward different directions along the circuit board, each of the elastic leg sections being extended onto the plate material side to elastically press the plate material.
Public/Granted literature
- US20120212926A1 ELECTRONIC DEVICE AND GROUND CONNECTION STRUCTURE Public/Granted day:2012-08-23
Information query