Invention Grant
US08717802B2 Reconfigurable multi-level sensing scheme for semiconductor memories
有权
用于半导体存储器的可重构多电平感测方案
- Patent Title: Reconfigurable multi-level sensing scheme for semiconductor memories
- Patent Title (中): 用于半导体存储器的可重构多电平感测方案
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Application No.: US13230442Application Date: 2011-09-12
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Publication No.: US08717802B2Publication Date: 2014-05-06
- Inventor: Chung H. Lam , Scott C. Lewis , Jing Li
- Applicant: Chung H. Lam , Scott C. Lewis , Jing Li
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Otterstedt, Ellenbogen & Kammer, LLP
- Agent Daniel P. Morris, Esq.
- Main IPC: G11C11/00
- IPC: G11C11/00

Abstract:
A method for sensing at least one parameter indicative of a logical state of a multi-level memory cell includes the steps of: measuring the parameter of the multi-level memory cell; comparing the measured parameter of the multi-level memory cell with a prescribed reference signal, the reference signal having a value which varies as a function of time; and storing a time value corresponding to a point in time at which the reference signal is substantially equal to the measured parameter of the multi-level memory cell, the stored time value being indicative of a sensed logical state of the multi-level memory cell.
Public/Granted literature
- US20120063195A1 Reconfigurable Multi-level Sensing Scheme for Semiconductor Memories Public/Granted day:2012-03-15
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