Embodiments of an interposer package structure are provided herein. Embodiments include a substrate having first and second opposing surfaces. An IC die electrically coupled to the first surface of the substrate. A plurality of contact members coupled to the first surface of the substrate. An interposer having a plurality of contact elements located on a first surface. Each conductive element coupled to a respective one of the plurality of contact members. The interposer is configured to facilitate wireless communication between the IC die and another device, heat spreading and electromagnetic interference shielding.