Invention Grant
US08718774B2 Housings for implantable medical devices and methods for forming housings
有权
用于植入式医疗装置的壳体和用于形成壳体的方法
- Patent Title: Housings for implantable medical devices and methods for forming housings
- Patent Title (中): 用于植入式医疗装置的壳体和用于形成壳体的方法
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Application No.: US12708059Application Date: 2010-02-18
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Publication No.: US08718774B2Publication Date: 2014-05-06
- Inventor: Michael A. Knipfer , John M. Edgell , Robbie L. Halvorson , Lawrence D. Swanson
- Applicant: Michael A. Knipfer , John M. Edgell , Robbie L. Halvorson , Lawrence D. Swanson
- Applicant Address: US MN St. Paul
- Assignee: Cardiac Pacemakers, Inc.
- Current Assignee: Cardiac Pacemakers, Inc.
- Current Assignee Address: US MN St. Paul
- Agency: Pauly, DeVries Smith & Deffner LLC
- Main IPC: A61N1/375
- IPC: A61N1/375
Abstract:
Described herein is an implantable medical device and methods for making a device that includes a metal housing a molding process. In one embodiment, the housing includes a header attachment element extends from the housing. In another embodiment, the implantable medical device includes a header attachment surface comprising one or more header retaining features configured to secure a connector header to the header attachment surface. In another embodiment, the housing includes one or more structural elements extending from and integrally molded with the interior surface of the first or second portions of the housing. Also disclosed are methods of making the implantable medical device.
Public/Granted literature
- US20100274309A1 HOUSINGS FOR IMPLANTABLE MEDICAL DEVICES AND METHODS FOR FORMING HOUSINGS Public/Granted day:2010-10-28
Information query
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