Invention Grant
- Patent Title: Optimized temperature-driven device cooling
- Patent Title (中): 优化的温度驱动装置冷却
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Application No.: US13163657Application Date: 2011-06-17
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Publication No.: US08718835B2Publication Date: 2014-05-06
- Inventor: Sriram Sankar , Mark E. Shaw
- Applicant: Sriram Sankar , Mark E. Shaw
- Applicant Address: US WA Redmond
- Assignee: Microsoft Corporation
- Current Assignee: Microsoft Corporation
- Current Assignee Address: US WA Redmond
- Agent Jim Sfekas; Alin Corie; Micky Minhas
- Main IPC: G05D23/00
- IPC: G05D23/00

Abstract:
An optimized temperature-driven device cooling mechanism factors in power consumption of thermal management components, as well as processing components. A decision engine consults a knowledge base comprising information regarding power consumption and thermal impact of cooling components and processing components. The decision engine can delay additional cooling if the power consumption of cooling components is greater than the increase in power consumption of processing components due to increases in ambient temperature. The knowledge base is populated by published specifications and by empirically derived data that can be based on tests performed on components. Thermal management strategies can be user selected and can include strategies that avoid controlling certain components such as, for example, processing components, instead focusing only on cooling and other components. Cooling includes heat distribution, such as by transferring processing from one processing component to another.
Public/Granted literature
- US20120323400A1 OPTIMIZED TEMPERATURE-DRIVEN DEVICE COOLING Public/Granted day:2012-12-20
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