Invention Grant
- Patent Title: High accuracy wireless sensing platform
- Patent Title (中): 高精度无线传感平台
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Application No.: US13077598Application Date: 2011-03-31
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Publication No.: US08718979B2Publication Date: 2014-05-06
- Inventor: Ertugrul Berkcan , Emad Andarawis Andarawis , Vinayak Tilak
- Applicant: Ertugrul Berkcan , Emad Andarawis Andarawis , Vinayak Tilak
- Applicant Address: US NY Niskayuna
- Assignee: General Electric Company
- Current Assignee: General Electric Company
- Current Assignee Address: US NY Niskayuna
- Agent Joseph J. Christian
- Main IPC: G06F19/00
- IPC: G06F19/00

Abstract:
A high accuracy wireless sensing platform assembly comprising a sensor subassembly that is configured to obtain measurement data from a device in response to a measurand; a data transceiver assembly that is configured to communicate with an antenna assembly; a parameter coder, in communication with the sensor subassembly, that is configured to control the data transceiver assembly and/or the sensor subassembly, based on the measurement data; and a resonant circuit that is formed by the data transceiver, the sensor subassembly, and/or the parameter coder. Embodiments are capable of provide robust performance and high accuracy in harsh (e.g., hot environments). The present invention has been described in terms of specific embodiment(s), and it is recognized that equivalents, alternatives, and modifications, aside from those expressly stated, are possible and within the scope of the appending claims.
Public/Granted literature
- US20120253747A1 HIGH ACCURACY WIRELESS SENSING PLATFORM Public/Granted day:2012-10-04
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