Invention Grant
- Patent Title: Modular sensor assembly including removable sensing module
- Patent Title (中): 模块化传感器组件,包括可移动传感模块
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Application No.: US13103891Application Date: 2011-05-09
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Publication No.: US08718981B2Publication Date: 2014-05-06
- Inventor: Paul Prehn Bey , William Hoover , Jamie Speldrich , Ryan Jones
- Applicant: Paul Prehn Bey , William Hoover , Jamie Speldrich , Ryan Jones
- Applicant Address: US NJ Morristown
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morristown
- Agency: Seager Tufte & Wickhem LLC.
- Main IPC: G06F15/00
- IPC: G06F15/00

Abstract:
A modular sensor assembly in which a sensing module may be packaged and provided separately from a signal processing module and which, in some applications, may facilitate disposal and/or replacement of the sensing module when exposed to a “dirty” or “contaminated” environment without requiring disposal and/or replacement of the entire sensor assembly. In certain applications, the sensing module may include at least one transducer or sensor and a local memory containing a set of conditioning coefficients. The sensing module may be removably coupled to a signal processing module which, in some cases, may be configured to download the set of conditioning coefficients stored in the local memory of the sensing module, and to use the set of conditioning coefficients to produce a substantially linearized output signal.
Public/Granted literature
- US20120290268A1 MODULAR SENSOR ASSEMBLY INCLUDING REMOVABLE SENSING MODULE Public/Granted day:2012-11-15
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