Invention Grant
- Patent Title: Graded dummy insertion
- Patent Title (中): 分级虚拟插入
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Application No.: US13562638Application Date: 2012-07-31
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Publication No.: US08719755B2Publication Date: 2014-05-06
- Inventor: Wen-Shen Chou , Yung-Chow Peng , Chih-Chiang Chang , Chin-Hua Wen
- Applicant: Wen-Shen Chou , Yung-Chow Peng , Chih-Chiang Chang , Chin-Hua Wen
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
- Current Assignee Address: TW Hsin-Chu
- Agency: Cooper Legal Group LLC
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
Among other things, one or more techniques for graded dummy insertion and a resulting array are provided herein. For example an array is a metal oxide semiconductor (MOS) array, a metal oxide metal (MOM) array, or a resistor array. In some embodiments, a first region and a second region are identified based on a density gradient between a first pattern density associated with the first region and a second pattern density associated with the second region. For example, the first pattern density and the second pattern density are gate densities and/or poly densities. To this end, a dummy region is inserted between the first region and the second region, the dummy region includes a graded pattern density based on a first adjacent pattern density and a second adjacent pattern density. In this manner, graded dummy insertion is provided, thus enhancing edge cell performance for an array, for example.
Public/Granted literature
- US20140040836A1 GRADED DUMMY INSERTION Public/Granted day:2014-02-06
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