Invention Grant
- Patent Title: Ultrasonic flowmeter apparatus
- Patent Title (中): 超声波流量计装置
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Application No.: US13737162Application Date: 2013-01-09
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Publication No.: US08720280B2Publication Date: 2014-05-13
- Inventor: Eiichi Murakami
- Applicant: Atsuden Co., Ltd.
- Applicant Address: JP Tokyo
- Assignee: Atsuden Co., Ltd.
- Current Assignee: Atsuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Holtz, Holtz, Goodman & Chick, PC
- Priority: JP2012-005307 20120113; JP2012-053436 20120309
- Main IPC: G01F1/20
- IPC: G01F1/20

Abstract:
A conduit P is clamped within a clamping hole 16 formed by min body 1, left and right side plates 2, 4 and top plate 3. The clamping hole is maintained by a locking mechanism 5, 5a and 11, and the conduit is deformed to have a substantially square cross section. Ultrasonic signal transmission and reception elements 13a and 13b are arranged in the main body such that an ultrasonic beam emitted from one of the elements is received by the other element after the beam is reflected by the top plate.
Public/Granted literature
- US20130180341A1 ULTRASONIC FLOWMETER APPARATUS Public/Granted day:2013-07-18
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