Invention Grant
- Patent Title: Electronic packaging apparatus and electronic packaging method
- Patent Title (中): 电子包装设备及电子包装方法
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Application No.: US13117584Application Date: 2011-05-27
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Publication No.: US08720519B2Publication Date: 2014-05-13
- Inventor: Takatoyo Yamakami , Hidehiko Kira , Takashi Kubota , Kiyoshi Oi , Kiyoaki Iida , Takashi Kurihara
- Applicant: Takatoyo Yamakami , Hidehiko Kira , Takashi Kubota , Kiyoshi Oi , Kiyoaki Iida , Takashi Kurihara
- Applicant Address: JP Nagano-shi
- Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee: Shinko Electric Industries Co., Ltd.
- Current Assignee Address: JP Nagano-shi
- Agency: Squire Sanders (US) LLP
- Priority: JP2010-185610 20100820
- Main IPC: B32B37/02
- IPC: B32B37/02

Abstract:
A bonding tool holds a lower chip against a release tape held by a suction force. The bonding tool has an electronic-component suction opening against which the lower chip is held and, surrounding the electronic-component suction opening, a trench that accommodates the release tape. The lower chip is heated, by being pressed against an underfill material and, thus, an area on which an upper chip is mounted is formed in such a manner that the underfill material protrudes out from the lower chip. During the heating, because an expanded part of the release tape, expanded due to heat, is inserted into the trench, no folded line is formed on the upper surface of the underfill material.
Public/Granted literature
- US20120043005A1 ELECTRONIC PACKAGING APPARATUS AND ELECTRONIC PACKAGING METHOD Public/Granted day:2012-02-23
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