Invention Grant
- Patent Title: Sealed t-joint assembly
- Patent Title (中): 密封t型接头总成
-
Application No.: US13473887Application Date: 2012-05-17
-
Publication No.: US08720905B2Publication Date: 2014-05-13
- Inventor: Michael Bossner , Curt R. Danielewicz , Keith A. Stahl , Brian W. Geiser
- Applicant: Michael Bossner , Curt R. Danielewicz , Keith A. Stahl , Brian W. Geiser
- Applicant Address: US MI Detroit
- Assignee: GM Global Technology Operations LLC
- Current Assignee: GM Global Technology Operations LLC
- Current Assignee Address: US MI Detroit
- Agency: Quinn Law Group, PLLC
- Main IPC: F02F11/00
- IPC: F02F11/00 ; F16J15/14

Abstract:
A sealed t-joint includes a first component having a first sealing surface, a second component having a second sealing surface, and a third component including a channel characterized by a channel height, channel width, and a channel depth. The t-joint also includes a gasket having a thickness and a protrusion characterized by a protrusion height, a protrusion width, and a protrusion depth. The protrusion height is less than the channel height, the protrusion width is less than channel width, and the protrusion depth is less than the channel depth. The t-joint additionally includes a polymer sealant. The gasket is compressed between the first and second sealing surfaces to generate a first and second component sub-assembly. Additionally, the polymer sealant is applied into the channel. The third component is subsequently assembled with the first and second component sub-assembly such that the protrusion extends into the channel to seal the t-joint.
Public/Granted literature
- US20130306008A1 SEALED T-JOINT ASSEMBLY Public/Granted day:2013-11-21
Information query