Invention Grant
- Patent Title: Sensor
- Patent Title (中): 传感器
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Application No.: US13521553Application Date: 2011-06-13
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Publication No.: US08721351B2Publication Date: 2014-05-13
- Inventor: Mikio Nitta
- Applicant: Mikio Nitta
- Applicant Address: JP Tokyo
- Assignee: Eagle Industry Co., Ltd.
- Current Assignee: Eagle Industry Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Harness, Dickey & Pierce, PLC
- Priority: JP2010-135205 20100614
- International Application: PCT/JP2011/063525 WO 20110613
- International Announcement: WO2011/158801 WO 20111222
- Main IPC: H01C10/38
- IPC: H01C10/38

Abstract:
The object of the present invention is to provide a sensor which has an advantage in reduction of the noise and for down sizing, and also which are capable to produce easily. A sensor comprising: a case member housing a resistance substrate and a mobile element which slides against said resistance substrate and formed with an aperture leading to said resistance substrate; a connector member having a connector terminal, a cover unit which is a part of a resin covering said connector terminal and covers said aperture of said case member, and a connector unit which is other part of the resin covering said connector terminal and is connected with an external terminal; and a clip resiliently contacting with said connector terminal and said resistance substrate, and electrically connecting said connector terminal and said resistance substrate.
Public/Granted literature
- US20120289091A1 SENSOR Public/Granted day:2012-11-15
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