A heat sink socket for cooling electronic devices has a heat conducting body having an upper surface for receiving an electrical component and a lower surface for engaging a supporting circuit board. An insulated terminal has an electrical insulating body supporting a first electrical terminal within the heat conducting body. The first electrical terminal connects an electrical contact of the electrical component to the circuit board. The heat sink socket may include a ground plane on the heat conducting body. The ground plane may have a second electrical terminal that connects an electrical contact of the electrical component to the circuit board.