Invention Grant
US08721395B2 Abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making
失效
具有平坦且一致的表面形貌的研磨工具，用于调节CMP垫和制造方法
- Patent Title: Abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making
- Patent Title (中): 具有平坦且一致的表面形貌的研磨工具，用于调节CMP垫和制造方法
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Application No.: US13384331Application Date: 2010-07-16
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Publication No.: US08721395B2Publication Date: 2014-05-13
- Inventor: Jianhui Wu , Guohua Zhang , Richard W. J. Hall
- Applicant: Jianhui Wu , Guohua Zhang , Richard W. J. Hall
- Applicant Address: US MA Worcester FR Conflans-Sainte-Honorine
- Assignee: Saint-Gobain Abrasives, Inc.,Saint-Gobain Abrasifs
- Current Assignee: Saint-Gobain Abrasives, Inc.,Saint-Gobain Abrasifs
- Current Assignee Address: US MA Worcester FR Conflans-Sainte-Honorine
- Agency: Abel Law Group, LLP
- Agent Joseph P. Sullivan
- International Application: PCT/US2010/042267 WO 20100716
- International Announcement: WO2011/009046 WO 20110120
- Main IPC: B24B53/00
- IPC: B24B53/00
Abstract:
An abrasive tool with flat and consistent surface topography for conditioning a CMP pad and method for making are disclosed. The abrasive tool includes abrasive grains coupled to a low coefficient of thermal expansion (CTE) substrate through a metal bond. There is an overall CTE mismatch that ranges from about 0.1 μm/m-° C. to about 5.0 μm/m-° C. The overall CTE mismatch is the difference between the CTE mismatch of the abrasive grains and the metal bond and the CTE mismatch of the low CTE substrate and the metal bond.
Public/Granted literature
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