Invention Grant
- Patent Title: Grinding apparatus for removing processing debris
- Patent Title (中): 用于除去加工碎屑的研磨装置
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Application No.: US13274560Application Date: 2011-10-17
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Publication No.: US08721398B2Publication Date: 2014-05-13
- Inventor: Teng-Tsung Huang , Yong-Bing Hu , Yuan-Zhao Li , Zhan Shang
- Applicant: Teng-Tsung Huang , Yong-Bing Hu , Yuan-Zhao Li , Zhan Shang
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: CN201110031037 20110128
- Main IPC: B24B55/02
- IPC: B24B55/02

Abstract:
A grinding apparatus includes a base, a case, a transmission module, an inlet water module and drain module. The case is positioned on the base. The transmission module is positioned on the base, and includes a motor and a grinding plate. The motor drives the grinding plate to rotate. The inlet water module is configured for feeding water onto the grinding plates. The drain module includes a drain pan and a drain pipe. The drain pan is detachably attached to the case, the drain pipe is connected to the drain pan, and is exposed from the case.
Public/Granted literature
- US20120196517A1 GRINDING APPARATUS FOR REMOVING PROCESSING DEBRIS Public/Granted day:2012-08-02
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