Invention Grant
- Patent Title: Modular intervertebral implant
- Patent Title (中): 模块性椎间植入物
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Application No.: US11769273Application Date: 2007-06-27
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Publication No.: US08721724B2Publication Date: 2014-05-13
- Inventor: Beat Lechmann , Robert Frigg
- Applicant: Beat Lechmann , Robert Frigg
- Applicant Address: US MA Raynham
- Assignee: DePuy Synthes Products, LLC
- Current Assignee: DePuy Synthes Products, LLC
- Current Assignee Address: US MA Raynham
- Agency: Meunier Carlin & Curfman, LLC
- Priority: CH2161/04 20041228
- Main IPC: A61F2/44
- IPC: A61F2/44

Abstract:
A modular intervertebral implant including a first and second component connectable in a ball-joint like manner. The first component having a first surface configured to abut an end plate of a first adjoining vertebral body and a concave spherical articulation surface with a radius R. The second component having a second surface configured to abut an end plate of a second adjoining vertebral body and a convex spherical articulation surface with substantially the same radius R as the concave spherical articulation surface.
Public/Granted literature
- US20070250168A1 MODULAR INTERVERTEBRAL IMPLANT Public/Granted day:2007-10-25
Information query
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