Invention Grant
- Patent Title: Method for manufacturing multilayer ceramic electronic component
- Patent Title (中): 多层陶瓷电子部件的制造方法
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Application No.: US13602354Application Date: 2012-09-04
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Publication No.: US08721820B2Publication Date: 2014-05-13
- Inventor: Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
- Applicant: Koji Sato , Yukio Sanada , Yasuhiro Nishisaka
- Applicant Address: JP Kyoto
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto
- Agency: Keating & Bennett, LLP
- Priority: JP2011-192358 20110905; JP2012-117712 20120523
- Main IPC: C03B29/00
- IPC: C03B29/00 ; H01G4/20 ; H01G4/06 ; H01G4/228
Abstract:
A method for manufacturing a multilayer ceramic electronic component significantly reduces and prevents swelling or distortion when a conductive paste is applied to a green ceramic element body. A ceramic green sheet used in the method satisfies 180.56≦A/B wherein A is a polymerization degree of an organic binder contained in the ceramic green sheet, and B is a volume content of a plasticizer contained in the ceramic green sheet.
Public/Granted literature
- US20130056133A1 METHOD FOR MANUFACTURING MULTILAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2013-03-07
Information query
