Invention Grant
US08721905B2 Method for forming minute pattern and method for forming minute pattern mask
有权
形成微小图案的方法和形成微图案掩模的方法
- Patent Title: Method for forming minute pattern and method for forming minute pattern mask
- Patent Title (中): 形成微小图案的方法和形成微图案掩模的方法
-
Application No.: US13431516Application Date: 2012-03-27
-
Publication No.: US08721905B2Publication Date: 2014-05-13
- Inventor: Se-Hwan Yu , Ji Seon Lee , Yoon Ho Khang , Kahp Yang Suh , Hyoung Sick Um , Jae Jun Chae , Sung Hun Lee
- Applicant: Se-Hwan Yu , Ji Seon Lee , Yoon Ho Khang , Kahp Yang Suh , Hyoung Sick Um , Jae Jun Chae , Sung Hun Lee
- Applicant Address: KR Yongin, Gyeonggi-Do KR Gwanak-Gu, Seoul
- Assignee: Samsung Display Co., Ltd.,SNU R & DB Fountdation
- Current Assignee: Samsung Display Co., Ltd.,SNU R & DB Fountdation
- Current Assignee Address: KR Yongin, Gyeonggi-Do KR Gwanak-Gu, Seoul
- Agency: F. Chau & Associates, LLC
- Priority: KR10-2011-0107653 20111020
- Main IPC: H01L21/302
- IPC: H01L21/302

Abstract:
A method for forming a minute pattern mask includes forming an etching target layer on a substrate. A convex pattern including a plurality of convex parts is formed on the etching target layer. A resin composition is coated on the convex pattern to form a resin layer including a first region neighboring the convex part and a second region positioned between the neighboring convex parts. The resin layer is ashed or etched to form the plurality of first resin patterns. The plurality of first resin patterns is processed to form a minute pattern mask including a plurality of second resin patterns. The etching target layer is etched using the plurality of second resin patterns as an etch mask to form a minute pattern.
Public/Granted literature
- US20130098869A1 Method for Forming Minute Pattern and Method for Forming Minute Pattern Mask Public/Granted day:2013-04-25
Information query
IPC分类: