Invention Grant
- Patent Title: Resin for thermal imprint
- Patent Title (中): 用于热压印的树脂
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Application No.: US13666339Application Date: 2012-11-01
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Publication No.: US08721950B2Publication Date: 2014-05-13
- Inventor: Takemori Toshifumi , Yoshiaki Takaya , Takahito Mita , Tetsuya Iizuka , Yuji Hashima , Takahisa Kusuura , Mitsuru Fujii , Takuji Taguchi , Anupam Mitra
- Applicant: Scivax Corporation , Maruzen Petrochemical Co., Ltd.
- Applicant Address: JP Tokyo JP Tokyo
- Assignee: Scivax Corporation,Maruzen Petrochemical Co., Ltd.
- Current Assignee: Scivax Corporation,Maruzen Petrochemical Co., Ltd.
- Current Assignee Address: JP Tokyo JP Tokyo
- Agency: Factor Intellectual Property Law Group, Ltd.
- Priority: JP2005-357014 20050927
- Main IPC: B29C59/02
- IPC: B29C59/02 ; C08G61/08 ; C08F8/04 ; C08F32/08

Abstract:
A resin for thermal imprint include a cyclic-olefin-based thermoplastic resin that contains at least one of skeletons represented by the following chemical equation 1 or the following chemical equation 2 in a main chain. The glass transition temperature Tg (° C.) and the value ([M]) of MFR at 260° C. satisfy the following equation 1, and [M]>10. The thermal imprint characteristics (transferability, mold release characteristic, and the like) are superior and the productivity (throughput) is improved. Tg(° C.)
Public/Granted literature
- US20130056906A1 RESIN FOR THERMAL IMPRINT Public/Granted day:2013-03-07
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